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Chenshi Tech operates precision CNC multi-axis grinding, slicing, and surface lapping machinery engineered specifically for brittle technical substrates:
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Thickness Range: Ultra-thin precision substrates from 0.1 mm, 0.33 mm, and 0.55 mm up to 50 mm+ heavy-duty optical blocks and pressure viewports.
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Machining Dimensional Tolerances: Standard precision milling achieves tolerances of ±0.05 mm. For high-accuracy optomechanical sensor housings, tight engineering tolerances down to ±0.02 mm are maintained.
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Strengthening Methods:
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Chemical Ion-Exchange Strengthening: Recommended for glass panels thinner than 2.5 mm (e.g., 0.7 mm, 1.1 mm, 2.0 mm). Conducted in a molten potassium nitrate (KNO3) salt bath, this process yields surface compressive stresses (CS ≥ 450 MPa) with zero optical distortion, making it the premier choice for touch screen bonding.
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Physical Thermal Tempering: Applied to glass thickness ≥ 3.0 mm (such as custom borosilicate 3.3 glass panels) to dramatically boost mechanical bending strength and thermal shock resilience[cite: 4, 7].
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